·Location:shenshishidai > PCB system board/FPC system board PCB system board/FPC system board

Our company has advanced PCB / FPC production lines, dedicated to rigid board, FPC flexible board, high-precision double-sided, multi-layer printed circuit board design and manufacturing. Professionals for domestic and foreign high-tech enterprises, factories, research institutes to provide support from the circuit design to mass production of one-stop service and strong technical support, can provide you with fast expedited proofing PCB model can meet your PCB board various requirements, such as lead-free ROHS environmental protection requirements, Goldfinger, Immersion Gold and other process requirements.
PCB system board, FPC system board process:
1, according to documents provided by the board to generate Gerber files for PCB system board.
2, according to the schematic provided, the design PCB board file and then the system board.
3, PCB design: based on the information you provide us to design schematics and PCB re-design of circuit board production model
Note: The schematic design costs extra.
4, according to physical model provided by the PCB to PCB, we copy for your board and then proceed to model PCB system board, mass production.

FPC system board on the main parameters:
1. Base material: polyimide / polyester substrate thickness: 0.025mm --- 0.125mm Minimum aperture: ¢ 0.30mm0.02mm
2. Copper thickness: 0.009mm 0.018mm 0.035mm 0.070mm 0.010mm
3. Resistance to soldering heat :85 --- 105 ℃ / 280 ℃ --- 360 ℃
4. Minimum line from :0.075 --- 0 .09 mm
5. Around the curve of resistance / chemical resistance: in line with international standards for printed circuit ipc
6. Process: solder coating, plug plating, coating, film type, solder type
fpc cable features:
1. Free bending, winding, folding, and sliding to make a million times;
2. Easy to use, exceptionally strong flexibility, small size, flexible; is conducive to inventory and reduce transportation costs;

Product Type:
We processed products are epoxy glass fiber material FR4, CEM1, CEM3, BT material, thick copper circuit boards, high TG circuit boards, aluminum heat board, ultra-thin ultra-small thick gold circuit boards, cell phone batteries key board, Halogen-free board, Rogers High frequency board, high number of backplanes. Technology products, including jet of pure tin, gold, immersion gold, immersion silver, immersion tin, OSP (anti-oxidation board), high TG, aluminum panels. Currently processing products have been widely used in computers, telecommunications, networks, appliances, instrumentation, medical, industrial, automotive, semiconductor microelectronics, LCD and LED, mobile phone camera modules and other fields.

Project

A large number of manufacturing capacity

Small amount of manufacturing capacity

Layers (maximum)

2-28

26-32

Plate type

FR-4, High TG board, aluminum sheet

PTFE, PPO, PPE

PTFE

Rogers, etc PTFE

Mixed compression plate

Layer 4 - 6 layers

Level 6 - 8 layers

Maximum size

610mm X 1100mm

Dimension Accuracy

± 0.13mm

± 0.10mm

Thickness range

0.2mm - 6.00mm

0.20mm - 8.00mm

Thickness Tolerance (t ≥ 0.8mm)

± 8%

± 5%

Thickness Tolerance (t <0.8mm)

± 10%

± 8%

Medium thickness

0.076mm - 6.00mm

0.076mm-0.100mm

Minimum line width

0.10mm

0.075mm

Minimum spacing

0.10mm

0.075mm

Outer layer copper thickness

8.75um--175um

8.75um--280um

Inner layer copper thickness

17.5um--175um

8.75um--175um

Drilling Hole (Mechanical)

0.25mm - 6.00mm

0.15mm - 0.25mm

Finish Hole (Mechanical)

0.20mm - 6.00mm

0.10mm - 0.20mm

Diameter Tolerance (Mechanical)

0.05mm

Hole Tolerance (Mechanical)

0.075mm

0.050mm

Aperture laser drilling

0.10mm

0.075mm

Aspect Ratio

10:01

12:01

Solder Type

Photosensitive green, yellow, black, purple, blue, ink

Minimum width of solder bridge

0.10mm

0.075mm

Solder Mask Clearance

0.05mm

0.025mm

Plug hole diameter

0.25mm - 0.60mm

0.60mm-0.80mm

Resistance tolerance

± 10%

± 5%

Type of surface treatment

HASL, Ni-Au

Immersion Tin, OSP

Plating nickel and gold, Immersion Tin

The relationship between aperture and the pad (normal process)

Diameter difference of 12Mil

Minimum Line Width / (general process)

6Mil

Minimum via diameter (normal process)

14mil

Prime Time Electronic Technology Co., Ltd., Shenzhen Tel :0755 -83983211, 83552460 Mobile: 13058188266,13352923650 Fax :0755 -81519370 Technical Support
QQ: 756304969,627838610 Address: Futian District, Shenzhen, Beijing Garden Road, 11th floor Support: Prime Time
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